Thermal Complexity Grows With AI Chips And Photonics

Key Takeaways: Photonics can speed up the movement of data using less energy, but the impact of heat, warpage, and other stresses needs to be fully understood up front. Understanding the transient behavior associated with multi-die assemblies is complex, but it opens the door to much more granular performance and thermal optimization. Tools that can accurately predict thermally accelerated aging are lacking today. Experts at the Table: Semiconductor Engineering sat down to discuss the impact of