Global Electronics Association and Fraunhofer Group for Microelectronics sign MoU to support advanced packaging industrial adoption

Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing. The collaboration focuses on the APECS pilot line, the European pilot line for advanced packaging and heterogeneous integration for electronics components and systems under the EU Chips Act. APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by Research Fab Micr