IC-Link expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support

IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC have announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities. As the newest member of the TSMC Open Innovation Platform (OIP) Cloud Alliance, IC-Link will become the first managed-cloud service supporting mixed-partner EDA flow for silicon design. With its cloud offering, IC-Link combines advanced-node technology