ERS Launches 310×310mm Packaging System For AI And Chiplet Chips

ERS electronic has delivered its first automated 310×310 mm panel-level packaging system to a semiconductor manufacturer, integrating bonding, debonding and detaping to support higher-throughput AI and chiplet packaging. ERS electronic has unveiled a fully automated 310×310 mm panel-level packaging (PLP) system designed for advanced semiconductor packaging applications involving AI and chiplet architectures.