HBM Set to Absorb 30 Per Cent of DRAM Wafer Capacity by 2027, Says Samsung

Rapid growth of high-bandwidth memory for AI hardware threatens to squeeze global supply of standard DRAM. High-bandwidth memory (HBM) could consume nearly 30 per cent of dynamic random access memory (DRAM) chipmakers’ total wafer capacity by 2027, up from approximately 20 per cent today, according to statements made by a senior Samsung Electronics executive reported […]