What If Photonics Could Be Soldered Like Chips?

Can optical interconnects move closer to AI compute without making packaging the next bottleneck? A compact 400-Gbps component offers a glimpse of one approach. LightSpeed Photonics has demonstrated a CPO-class optical interconnect component capable of transferring 400 Gbps at less than 2 W in a compact 9 mm × 9 mm footprint.