3D Chips Push EDA Into New Territory

Key Takeaways : EDA tools are helping design 3D-ICs and multi-die systems by co-optimizing across domains and speeding up design exploration. Customers face several pain points, including vendor interoperability, dynamic floor-planning, IR analysis, and STA analysis. Agentic AI adds an extra layer on existing tools and serves as the foundation for new startup solutions. As demand for AI power and performance grows, chip designs increasingly involve 3D stacking, chiplets, and heterogeneous integr