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deep tech Semiconductor Engineering September 24, 2026

Managing 3D-IC Design And IP

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By Keith Felton and Todd Burkholder The trend towards multi-chiplet heterogeneous integration is here to stay. It promises faster innovation, more powerful and specialized devices, and greater design flexibility. However, realizing its potential hinges on our ability to manage the complexity that comes with it. However, with this newfound modularity comes a significant challenge: managing the vast and intricate web of data that defines these systems. This is where robust data management and meti

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