Rwanda Signs MoU With ChipMango to Build Local Semiconductor Design Skills

Rwanda’s Ministry of ICT and Innovation has signed a Memorandum of Understanding (MoU) with ChipMango to strengthen the country’s semiconductor design capabilities and develop local expertise in chip design. The agreement followed a meeting between Rwanda’s Minister of State, Yves Iradukunda, and ChipMango, where both sides discussed opportunities to build Rwanda’s semiconductor ecosystem and equip young Rwandans with practical skills in chip design. Under the partnership, the two parties will f