Chip Industry Technical Paper Roundup: Sept. 22

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organization Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements Peking University DRC-Aid: Design-Rule Correction via Agentic Framework utilizing Inference-Time LLMs Purdue University Routing Dense Layouts with History-Aware Offline Reinforcement Learning using LSTM New