Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

Researchers at Peking University published a technical paper titled “Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements.” Abstract Excerpt: “The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (κ) modeling framework. However, generalizable models derived from layer-resolved therm