Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech)

Researchers at the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published a technical paper titled “IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning.” Abstract Excerpt: “We introduce IC-ThermBench, an open and progressive benchmark that combines established 3D-IC steady-state, transient, and industrial package tasks with a new 50,000-sample 2.5D chiplet extension designed to evaluate progressively broader