HI has lots of costly semiconductor chips on a package, and you don't want defects killing them

There was another panel discussion around advanced packaging at the ongoing Semicon India 2026. The participants were: Tim McIntosh, VP, TSAT Business Head, Tata Electronics, Manish Ranjan, Business Management, HI, Applied Materials, Dr. Akshay Singh, Corporate VP, Micron Technology, and Babu Mandava, President and CEO, 3dGS.