Negative Expansion Materials Resist Warpage

Key Takeaways: Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) materials, newly on the market, can help counter warpage. Commercial NTE materials are starting to be used in semiconductor packaging, but broader adoption will depend on temperature range, compatibility of different materials, and uniform mixing and purity. Thermally induced warpage, caused by differences in the rate at which materials expand when heated, is beco