Why Package Digital Twins Are So Hard To Build

Key Takeaways: Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can undermine otherwise precise simulations. Coupled physics and ongoing calibration keep models tied to physical reality. A chiplet can be fully characterized, tested, and considered known good, but none of that guarantees it will stay that way after it’s placed into a different package. While the chiplet itself may be unchanged, nearly everything around it can m