Scaling Thermal Analysis From Transistors To Data Centers

Key Takeaways: Thermal is becoming an architectural constraint, requiring trade-offs in power, performance, reliability, floor-planning, packaging, and cooling. Chiplets and advanced packaging make thermal analysis harder because hotspots, crosstalk, materials, and cooling must be evaluated across the entire package and system, not just individual dies. More scalable multi-physics modeling, reduced-order models, digital twins, and tightly coupled physics solvers are needed to accurately predict