Chip Industry Technical Paper Roundup: Sept. 14

New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration National University of Singapore REACH: Controller-Managed Long-Span ECC for HBM AI Inference RPI , IBM T. J. Watson Research Center High contrast EUV imaging enabled by topological quasi phase-only masks NYCU , TSMC Predicting Cure Evolution and Thermal Endurance of a Hig