Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)

Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect architectures. Their performance is strongly influenced by cur